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XC7Z100-1FF900I XC7Z100-1FF900I

903-XC7Z100-1FF900I

Manufacturer:

Xilinx

Product Number:

903-XC7Z100-1FF900I

Description:

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Package 900-BBGA, FC

Description:

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.Internally, this SoC design uses the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 444K Logic Cells.Housed in the state-of-art Tray package.This SoC part has a total of 130 I/Os.During operation, the wireless SoC runs at a frequency of 667MHz.In terms of core architecture, the SoC meaning relies on ARM.The SoC computing will start only if -40°C is set.This SoC system on chip operates at a maximum design temperature of 100°C.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z100-1FF900I System On Chip (SoC) applications.

  • Central inverter
  • ARM Cortex M4 microcontroller
  • RISC-V
  • Robotics
  • Keyboard
  • Networked Media Encode/Decode
  • Smart appliances
  • AC drive control module
  • Sports
  • Wireless networking


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XC7Z100-1FF900I information

Specifications
ACL Staticide Inc XC7Z100-1FF900I technical specifications, attributes, parameters and parts with similar specifications to ACL Staticide Inc XC7Z100-1FF900I
  • Type
    Parameter
  • Factory Lead Time
    10 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Supplier Device Package
    900-FCBGA (31x31)
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Max Operating Temperature
    100°C
  • Min Operating Temperature
    -40°C
  • Frequency
    667MHz
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • Speed
    667MHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Max Frequency
    667MHz
  • Primary Attributes
    Kintex™-7 FPGA, 444K Logic Cells
  • RoHS Status
    Non-RoHS Compliant
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